English 
日医総研 Inc., a developer of wireless implantable BMI system medical devices, has raised a total of 350 million yen through a third-party allotment of new shares underwritten by Keio Innovation Initiative Inc. (KII), Kyoto University Innovation Capital Co., Ltd., and Green Core Co., Ltd. The Series A round of funding brings the Company’s total funding to approximately 850 million yen.
Additionally, the company also announced that it has been selected for the Seed stage Technology-based Startups (STS) phase in the fifth call for applications for the New Energy and Industrial Technology Development Organization (NEDO)’s Deep Tech Startup Practical Research and Development and Mass Production Demonstration Support Program (DTSU).
こちらもお読みください： ニューシグナル・セラピューティクスがシリーズA資金調達で$2250万ドルを調達
今回の第三者割当増資とNEDOのDTSU事業への採択により、2025年に予定されているALS患者を対象とした企業治験の準備を加速させるとともに、国内外のパートナー企業と連携し、製品の改良と事業基盤の構築を進めてまいります。
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