English 
Resonac Corporation announced the establishment of “JOINT3,” a co-creation evaluation framework formed by a consortium comprising Resonac and 26 other companies from Japan, the United States, Singapore, etc. These companies, all significant global leaders in the semiconductor supply chain, will jointly develop materials, equipment, and design tools optimized for panel-level organic interposers—semiconductor packaging technology that utilizes organic materials to create a bridge between different components on a circuit board—using a prototype production line for the manufacture of 515 x 510mm panel-level organic interposers.
レゾナック will establish an “Advanced Panel Level Interposer Center (APLIC)” as the main hub for this initiative within its Shimodate Plant (Minami-yuki) in Yuki City, in Japan’s Ibaraki Prefecture. APLIC will house the prototype production line, which is scheduled to commence operations in 2026.
このコンソーシアムでは、実世界の構造を忠実に反映した検証結果を提供することで、開発努力を加速します。
近年、次世代半導体の分野では、後工程のパッケージングが重要な技術として注目されています。この中には、複数の半導体チップを並列に配置し、インターポーザを介して接続する2.xDパッケージも含まれ、データ通信の大容量化・高速化のニーズに伴い、需要の拡大が見込まれています。半導体の高性能化に伴い、インターポーザーの大型化が進み、シリコンインターポーザーから有機材料を用いた有機インターポーザーへの移行が進んでいます。
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従来の製造方法では、円形のウェハーから長方形のピースを切り出します。しかし、インターポーザーの大型化に伴い、1枚のウェハーから得られるインターポーザーの数が減少することが大きな課題となっています。そこで、円形ウェーハから正方形のパネル形状に移行することで、一定面積のウェーハから得られるインターポーザーの数を増やす製造方法が注目されています。
レゾナックは、JOINT3コンソーシアムのリーダーとして、研究開発の優先順位を提案するとともに、試作ラインの運営を管理し、構想全体の進捗を推進します。また、参加企業との共創により、パネルレベルの有機インターポーザに最適な材料開発を推進します。
Hidehito Takahashi, President and CEO of Resonac Holdings Corporation stated “JOINT3 brings together world-class companies from a variety of fields. Combining the complementary strengths and expertise of each company allows us to collectively address challenges in areas that were previously unreachable. This endeavor goes beyond mere technological development and will lead to solutions that address societal challenges. We are excited by the potential that this initiative offers.”
Sumie Segawa, Vice President & General Manager, Division Officer, Corporate Innovation Division of Tokyo Electron Ltd., a participating company, commented, “Advanced packaging for AI semiconductors depends on miniaturization for high speed signaling and lower power, together with scaling for greater capacity. By combining JOINT3’s interposer technology with Japan’s superior materials and processing expertise, we will enable high quality, reliable manufacturing and jointly pursue further advances in AI semiconductors.”
William F. Mackenzie, Group Managing Executive Officer, Ushio Inc., another participating company, remarked, “Advanced packaging is entering a new era, demanding innovation and collaboration across the ecosystem. As a core enabler, lithography is key to meeting these challenges. Through our Digital Lithography Technology and partnership in the JOINT3 consortium, Ushio is working with industry leaders to deliver the precision and performance the future demands.”
Resonac will leverage the knowledge gained from the semiconductor packaging technology development consortia “JOINT” and “JOINT2,” which transcend the boundaries of semiconductor equipment and materials manufacturers, as well as that sourced from “US-JOINT,” which is being developed in Silicon Valley in the United States. By doing so, Resonac aim to contribute to technological innovation in next-generation semiconductor packaging.
ソース ビジネスワイヤー
日本語